SK Hynix has announced the world’s first 238-layer NAND chips. The 512Gbps TLC 4D NAND 238-layer chip is the next generation of chips after the development of 176-layer NAND chips in December 2020. As announced at the Flash Memory Summit 2022 in Santa Clara, mass production of memory will only begin in the first half of 2023. In 2023, SK Hynix also plans to introduce 238-layer 1TB products.
The new chips have a smaller cell area per unit and higher efficiency, requiring 21% less power to read data. What’s more, their reduced size allows SK Hynix to produce more chips per wafer, improving overall performance by 34% compared to 176-layer NAND. 238-layer NAND chips will first appear on consumer SSDs in 2023. SK Hynix is also planning to release a 238-layer product that will be able to transfer data at 2.4Gbps, which is 50% faster than the previous generation.